Product Overview
The XH-GS0101GWP is a counter-UAV series RF SiP product based on wafer-level System-in-Package technology. Operating in the 14-18GHz Ku-band, it integrates 4-channel T/R links and amplitude-phase control functions, embedding power amplifier, low noise amplifier, T/R switch, digital phase shifter/attenuator and temperature sensor on a single chip. It supports time-division transmit/receive mode and can be directly used as the basic T/R unit of phased array radars.
This module integrates traditional discrete RF transceiver links into an ultra-compact 11.1×7.3×0.3mm package, greatly reducing front-end circuit size and BOM cost, and simplifying customer R&D and debugging. Featuring high integration, excellent performance, mass producibility and high consistency, it is widely applicable to Ku-band phased array scenarios such as counter-drone radar, low-altitude security and satellite communication.
Core Advantages
Wafer-level High-integration SiP Packaging: Integrates 4-channel T/R links, amplitude-phase control and sensing circuits into a single chip with only 11.1×7.3×0.3mm size, greatly reducing RF front-end dimensions
4-channel Integrated T/R Function: Built-in PA, LNA and T/R switch for time-division operation, one module completes 4-channel transmit amplification and receive low-noise amplification
High-performance RF Specifications: 30dBm (1W) transmit power, 3.5dB low receive noise figure and high phase/attenuation accuracy to meet phased array beamforming requirements
Built-in Temperature Sensing Unit: On-chip temperature sensor for real-time chip status monitoring, thermal management and performance compensation
Low Cost & Mass Deployment Ready: High integration greatly reduces external component count, BOM cost and production debugging effort, suitable for large-scale phased array antenna deployment
Industrial-grade Environmental Reliability: Wafer-level packaging delivers high reliability for harsh industrial and outdoor equipment environments
Technical Specifications
| Category | Item | Specification |
|---|---|---|
| Basic Information | Model | XH-GS0101GWP |
| Package Type | Wafer-level SiP | |
| Dimensions | 11.1 × 7.3 × 0.3 mm | |
| Channels | 4 Transmit/Receive Channels | |
| Transmit RF Spec | Operating Frequency | 14 – 18 GHz |
| Transmit Gain | 28 dB (typical) | |
| Transmit Power | 30 dBm (typical, 1W) | |
| Power Added Efficiency (PAE) | 20 % (typical) | |
| RMS Phase Shift Accuracy (Tx) | 3 ° (typical) | |
| Receive RF Spec | Receive Gain | 24 dB (typical) |
| Receive Noise Figure | 3.5 dB (typical) / 4 dB (max) | |
| RMS Phase Shift Accuracy (Rx) | 5 ° (typical) | |
| RMS Attenuation Accuracy (Rx) | 0.5 dB (typical) | |
| Functional Features | Operation Mode | Time-division T/R (FMCW compatible) |
| Integrated Functions | PA, LNA, Switch, Amplitude-phase Modulation, Temperature Sensor | |
| Environmental | Operating Temperature | -40℃ ~ 85℃ (Industrial Grade) |
